標題: PCB設計中專業英譯術語之形狀與尺寸 [打印本頁]
作者: 板兒妹0517 時間: 2018-5-10 14:46
標題: PCB設計中專業英譯術語之形狀與尺寸
1. 導線（信道）：conduction (track)
2. 導線（體）寬度：conductor width
3. 導線距離：conductor spacing
4. 導線層：conductor layer
5. 導線寬度/間距：conductor line/space
6. 第一導線層：conductor layer No.1
7. 圓形盤：round pad
8. 方形盤：square pad
9. 菱形盤：diamond pad
10. 長方形焊盤：oblong pad
11. 子彈形盤：bullet pad
12. 淚滴盤：teardrop pad
13. 雪人盤：snowman pad
14. V形盤：V-shaped pad
15. 環形盤：annular pad
16. 非圓形盤：non-circular pad
17. 隔離盤：isolation pad
18. 非功能連接盤：monfunctional pad
19. 偏置連接盤：offset land
20. 腹（背）裸盤：back-bard land
21. 盤址：anchoring spaur
22. 連接盤圖形：land pattern
23. 連接盤網格陣列：land grid array
24. 孔環：annular ring
25. 組件孔：component hole
26. 安裝孔：mounting hole
27. 支撐孔：supported hole
28. 非支撐孔：unsupported hole
29. 導通孔：via
30. 鍍通孔：plated through hole (PTH)
31. 余隙孔：access hole
32. 盲孔：blind via (hole)
33. 埋孔：buried via hole
34. 埋/盲孔：buried /blind via
35. 任意層內部導通孔：any layer inner via hole (ALIVH)
36. 全部鉆孔：all drilled hole
37. 定位孔：toaling hole
38. 無連接盤孔：landless hole
39. 中間孔：interstitial hole
40. 無連接盤導通孔：landless via hole
41. 引導孔：pilot hole
42. 端接全隙孔：terminal clearomee hole
43. 準表面間鍍覆孔：quasi-interfacing plated-through hole
44. 準尺寸孔：dimensioned hole
45. 在連接盤中導通孔：via-in-pad
46. 孔位：hole location
47. 孔密度：hole density
48. 孔圖：hole pattern
49. 鉆孔圖：drill drawing
50. 裝配圖：assembly drawing
51. 印制板組裝圖：printed board assembly drawing
52. 參考基準：datum referan
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